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Cool Chips Press Release Dated 31 July 2002


Refers to COLCF and BOREF

Cool Chips plc
31 July 2002

Cool Chips plc (COLCF) announces that a patent, titled “Method for Making a Diode Device” No. 6,417,060, was issued by the US Patent Office on July 9th, 2002.

The patent refers to a method for manufacturing nanotech energy conversion devices such as Cool Chips™, a proprietary cooling technology that promises efficiency levels much higher than existing solid-state cooling systems.

The method involves creating a tiny gap, measured in nanometers, between two electrodes. An electrode is coated with a sublimative material such as Cadmium and then depositing a second electrode on top. Because the Cadmium layer is very thin, any surface variation on the lower electrode will be mirrored on the upper, deposited electrode, so a very small but constant gap is maintained between the two. When the upper surface has been deposited, the device is heated in a vacuum chamber from which the sublimative layer is removed as a vapor.

Cool Chips™ are wafer-thin discs designed to produce cooling or refrigeration more efficiently than any competing technology, using quantum mechanical electron tunneling as the primary cooling mechanism. The Cool Chip™ is one of the first transformative technologies to emerge from the nanotechnology revolution.

Because of the inherent advantages in cooling across a gap using electron tunneling, Cool Chips™ are projected to attain efficiencies much higher than those available in current cooling systems, and they are much less than 10% of the size and weight of compressors. Cool Chips™ are modular, and can be packaged in arrays to cool virtually any size heat load.

“Cool Chips™ have applications wherever heat management is an issue” said Cool Chips plc President Isaiah Cox. “This is a new, elegant method for manufacturing matched pairs of electrodes and maintaining a consistent gap at the nanometer level. We are now building increasingly compact devices and continually improving our manufacturing techniques as we drive towards commercial production prototypes.”

The technology is protected by an extensive patent portfolio covering general theory and specific techniques for thermo-tunneling and thermal energy conversion. More details are available on the Cool Chips plc web site at including the full text of this and other patents.

Cool Chips plc (COLCF) is a majority-owned subsidiary of Borealis Exploration Limited (BOREF) and has 7,365,460 shares outstanding as of 31 March 2002 Audited Accounts. Borealis Exploration Limited has 4,982,605 shares outstanding as of 31 March 2002 Audited Accounts. Both companies are based in Gibraltar. Borealis’ business is reinventing the core technologies used by basic industries, including electric motors, steelmaking, electrical power generation, and cooling and thermal management.

For further information contact:

Chris Bourne
Head of Public Relations
Cool Chips plc
+44 20 8571 5216

Forward Looking Statement at

keywords: quantum tunnel nanometer angstrom nanotechnology aerospace automotive cooling refrigeration HVAC thermal management

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