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Cool Chips Press Release Dated 6 Aug 2002


Refers to COLCF and BOREF

Cool Chips plc
6th August 2002

Cool Chips plc (COLCF) will be presenting its cooling technology in detail, including recent laboratory results, in a paper at the 21st International Conference on Thermoelectrics August 25-29, 2002, to be held at the Hyatt Regency Hotel, Long Beach, California, USA.

The paper, by Cool Chips physicist Avtandil Tavkhelidze and co-authors Givi Skhiladze, Amiran Bibilashvili, Leri Tsakadze, Larisa Jangadze, Zaza Taliashvili, Isaiah Cox, Zauri Berishvili, and titled “Preliminary Results on Electron Tunneling Through Large Area Vacuum Gaps” will be given by Dr. Tavkhelidze on Monday 26th August at 5pm.

Cool Chips™ are wafer-thin discs designed to produce cooling or refrigeration more efficiently than any competing technology, using quantum mechanical electron tunneling as the primary cooling mechanism. The Cool Chip™ is one of the first transformative technologies to emerge from the nanotechnology revolution.

Because of the inherent advantages in cooling across a gap using electron tunneling, Cool Chips are projected to attain efficiencies much higher than those available in current cooling systems, and they are much less than 10% of the size and weight of compressors. Cool Chips are modular, and can be packaged in arrays to cool virtually any size heat load.

At the conference Dr Tavkhelidze will describe how the Cool Chips plc research team has obtained tunneling currents of over 10 amps through the vacuum gap between conformal electrodes. A large area vacuum gap is obtained using a surface replication method allowing exact matching of the surfaces of two electrodes.

The paper will discuss measured current-voltage (I-V) characteristics of the system, and demonstrate that capacitance and conductance dependence on the distance between electrodes is also in good agreement with a simple model of electrodes separated by a vacuum gap.

The technology is protected by an extensive patent portfolio covering general theory and specific techniques for thermo-tunneling and thermal energy conversion. More details are available on the Cool Chips plc web site at including the full text of this and other patents.

Cool Chips plc (COLCF) is a majority-owned subsidiary of Borealis Exploration Limited (BOREF) and has 7,365,460 shares outstanding as of 31 March 2002 Audited Accounts. Borealis Exploration Limited has 4,982,605 shares outstanding as of 31 March 2002 Audited Accounts. Both companies are based in Gibraltar. Borealis’ business is reinventing the core technologies used by basic industries, including electric motors, steelmaking, electrical power generation, and cooling and thermal management.

For further information contact:

Chris Bourne
Head of Public Relations
Cool Chips plc
+44 20 8571 5216

Forward Looking Statement at

keywords: quantum tunnel nanometer angstrom nanotechnology aerospace automotive cooling refrigeration HVAC thermal management

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