With an active cooling solution, the following benefits accrue:
1: The chip can run hotter, without raising the junction temperature, by dumping the heat to the Cool Chip layer which keeps the cold side nears 0°C.
2: Because the hot heat sink can be run at an elevated temperature, it can dissipate more heat using the same area. In other words, a hotter heat sink can be smaller. The same is true for the amount of air flow required.
3: A colder chip is more reliable, and can be clocked to run faster. Cool Chips™ can greatly
reduce chip failures.
4: Once Cool Chips are established as the cooling solution, the processor designer's job becomes
much simpler. He does not have to worry about dissipating heat to a hot heat sink -- instead he
has the far easier job of getting heat to a cold plate mounted on the processor.